Solder paste
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Solder paste
Solder paste
Solder paste acc. to DIN EN 29454-1 1.1.2.C is a medium activity flux in the form of a paste, based on rosin and organic halogen activator, for easy soldering of copper, silver, zinc and nickel items. It is used in lead-tinning and soldering in the radio and telecommunication technology as well as in installation of electrical equipment. Post-soldering flux residues do not cause corrosion of non-ferrous metals and may remain on the joints. (it is advisable to wash them with alcohol remover). The product is used where rosin is not enough.
Volume | Unit | Product Code |
---|---|---|
100g (metal can) | 5 or 50 | ART.AGT-038 |
- Soldering copper
- silver
- zinc and nickel plated components