TIN-PLATING OF COPPER
4,000 €
Aucune taxe
FORMULATION FOR DRY-CONTACT TIN-PLATING OF COPPER
FORMULATION FOR DRY-CONTACT TIN-PLATING OF COPPER
A high-quality currentless (chemical) bath for printed circuits. It creates hermetic, glossy, 5-12 μm thick coatings with very good adhesion. The preparation provides protection against harmful effect of air and moisture.
Usage: Dissolve the preparation in 0.5 l of water at a temperature of 80-90°C
Volume | Unit | Product code |
---|---|---|
45g (plastic bag) | 1 or 60 | ART.AGT-111 |
90g (bottle) | 1 or 18 | ART.AGT-086 |
protection against harmful effect of air and moisture