TIN-PLATING OF COPPER
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  • TIN-PLATING OF COPPER

TIN-PLATING OF COPPER

4,000 €
Aucune taxe

FORMULATION FOR DRY-CONTACT TIN-PLATING OF COPPER

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FORMULATION FOR DRY-CONTACT TIN-PLATING OF COPPER

A high-quality currentless (chemical) bath for printed circuits. It creates hermetic, glossy, 5-12 μm thick coatings with very good adhesion. The preparation provides protection against harmful effect of air and moisture.

Usage: Dissolve the preparation in 0.5 l of water at a temperature of 80-90°C

VolumeUnitProduct code
45g (plastic bag) 1 or 60 ART.AGT-111
90g (bottle) 1 or 18 ART.AGT-086

protection against harmful effect of air and moisture

TIN-PLATING OF COPPER