ICK BGA 27x27

0,62 €

ICK BGA 27x27 Heatsinks for BGAs

27 x 27 x 6 mm, for IC design BGA and others

Quantity

  • security guarantee security guarantee
  • Appropriate packaging Appropriate packaging
  • Exchange under warranty Exchange under warranty

ICK BGA 27 x 27 x 6 mm, for IC design BGA and others

 

way of fixation
  • therm. conductive foil
  • therm. cond. adhesive
socket
universal
suitable for processor type
universal
width
27 mm
height
6 mm
plate thickness
1.8 mm
length
27 mm
thermal resistance Rth
20 - 6.5 K/W
dissipation loss Pv
3.1 W
surface
black anodised

 

 

ICK BGA 27x27